Aerocool VERKHO3PLUS computer cooling system Processor Cooler 12 cm Aluminium, Black, Blue

 Description by backtotheoffice

TDP (Thermal Design Power) up to 125W Compact side flow air cooler for maximum compatibility Heat Core Touch Technology and 3 ultra-efficient thermal heat pipes Upgraded high efficiency fins for optimal thermal performance Ultra-slim profile, works with most current motherboard designs: LGA 1150/1151/1155/1156/1366/775 and AM4/AM3+/AM3/AM2+/AM2/FM2/FM1 Comes with 3 ultra-efficient thermal heat pipes.

Air cooling solution powered by Heat Core Touch Technology (HCTT) and equipped with high efficiency fins, TDP up to 125W. Compatible with most current motherboard designs: LGA 1150/1151/1155/1156/1366/775 and AM4/AM3+/AM3/AM2+/AM2/ FM2/FM1. Performance Maximum air pressure 1.24 mmH2O Minimum air pressure 0.78 mmH2O Maximum airflow 55.6 cfm Minimum airflow (imperial) 29.1 cfm Noise level (high speed) 26.7 dB Noise level (low speed) 18.2 dB Rotational speed (max) 2000 RPM Rotational speed (min) 1000 RPM Supported processor sockets LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 775 (Socket T), Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket AM4, Socket FM1, Socket FM2 Fan diameter 12 cm Type Cooler Suitable location Processor Design Fan connector 4-pin Number of heat pipes 3 Number of fans 1 fan(s) Product colour Aluminium, Black, Blue Power Thermal Design Power (TDP) 125 W Rated current 0.2 A Starting voltage 5 V Rated voltage 12 V Power consumption (typical) 2.4 W Weight & dimensions Package height 175 mm Package depth 135 mm Package width 104 mm Heat pipes diameter 6 mm Height 134 mm Depth 78 mm Width 125 mm Other features Mean time to failure (MTTF) 60000 h Logistics data Products per master (outer) case 18 pc(s) Master (outer) case height 365 mm Master (outer) case length 425 mm Master (outer) case width 330 mm leaflet