Netac Basic DDR4-3200 8G C16

 Description by backtotheoffice

Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals Low-power auto self refresh (LPASR) Data bus inversion (DBI) for data bus On-die VREFDQ generation and calibration On-board I2C serial presence-detect (SPD) EEPROM Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Databus write cyclic redundancy check (CRC) Temperature controlled refresh (TCR) Command/Address (CA) parity Per DRAM Addressability is supported 8 bit pre-fetch Fly-by topology Command/Address latency (CAL) Terminated control command and address bus PCB: Height 1.23? (31.25mm) Gold edge contacts RoHS Compliant and Halogen-Fre Netac Basic DDR4 Original chips improve the performance of computer Selected original chips, strict inspection process, 8-layer PCB board, stable performance Excellent compatibility Memory products have passed the motherboard compatibility test of mainstream brands on the market, ensure the stability of the system for along time Gold-plated craft gold finger Gold plating process, stronger conductivity and corrosion resistance Features Lead plating Gold SPD profile Yes Programming power voltage (VPP) 2.5 V Intel Extreme Memory Profile (XMP) Yes Memory voltage 1.35 V Memory channels Single-channel CAS latency 16 ECC No Memory form factor 288-pin DIMM Component for PC/Server Memory clock speed 3200 MHz Internal memory type DDR4 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Buffered memory type Unregistered (unbuffered) Operational conditions Storage temperature (T-T) -55 - 100 °C Operating temperature (T-T) 0 - 85 °C Technical details Compliance certificates RoHS Sustainability Doesn't contain Halogen Weight & dimensions Height 31.2 mm Width 133.3 mm leaflet