Kingston Technology KSM26SES8/16MF memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC

 Description by backtotheoffice

Functionality and operations comply with the DDR4 SDRAM datasheet 16 internal banks Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available Data transfer rates: PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600 Bi-Directional Differential Data Strobe 8 bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop) Supports ECC error correction and detection On-Die Termination (ODT) Temperature sensor with integrated SPD This product is in compliance with the RoHS directive Per DRAM Addressability is supported Internal Vref DQ level generation is available Write CRC is supported at all speed grades CA parity (Command/Address Parity) mode is supported Kingston's KSM26SES8/16MF is a 2G x 72-bit (16GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM) w/ parity, 1 Rx8, ECC, memory module, based on nine 2G x 8-bit FBGA components.

The SPD is programmed to JEDEC standard latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 260-pin SODIMMuses gold contact fingers. Features JEDEC standard Yes Lead plating Gold SPD profile Yes Programming power voltage (VPP) 2.5 V Row active time 32 ns Refresh row cycle time 350 ns Row cycle time 45.75 ns Module configuration 2048M x 72 Memory voltage 1.2 V Memory ranking 1 CAS latency 19 ECC Yes Memory form factor 260-pin SO-DIMM Component for PC/Server Memory clock speed 2666 MHz Internal memory type DDR4 Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Buffered memory type Unregistered (unbuffered) Operational conditions Storage temperature (T-T) -55 - 100 °C Operating temperature (T-T) 0 - 85 °C Technical details Compliance certificates RoHS Sustainability Doesn't contain Halogen Weight & dimensions Height 30 mm Depth 3.7 mm Width 69.6 mm Logistics data Harmonized System (HS) code 84733020 leaflet